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Mr. Steven Groothuis is the Chief Technology Officer at Samtec Microelectronics in Colorado Springs and maintains the package technology & strategic roadmaps for Samtec’s microelectronic packaging products. He is involved in Integrated Circuit, MEMS, sensor, optical, and photonics package technology path finding. He is a strategist, technologist, and internal technology advisor. He has dealt with products in the autonomous vehicles, biomedical, optical/photonics, MEMS/Sensors, and microelectronics arenas. Prior to joining Samtec, he was a Distinguished Member of Technical Staff at Micron Technology providing technology advancements on the advanced Hybrid Memory Cube package development, technology path finding, and wafer- and package-related simulations. Mr. Groothuis also worked at ANSYS as a Multiphysics Industry Specialist on various MEMS simulation initiatives. He started his career as a package technologist at Texas Instruments and served as TI’s Advanced Semiconductor Packaging Lab Manager. Mr. Groothuis received his BS Physics from Michigan State University and MS Physics from University of Texas at Dallas. He has coauthored over 50 technical papers, holds eleven US patents, and has been a worldwide technical instructor on IC and MEMS technologies.